28.01.99 ? by semikron skiip 3-phase bridge absolute maximum ratin g s symbol conditions 1) values units v isol 4) ac, 1min 3000 v t op ,t stg operating / stor. temperature -25...+85 c igbt and inverse diode v ces 1200 v v cc 5) operating dc link voltage 900 v i c igbt 200 a t j 3) igbt + diode -40...+150 c i f diode 200 a i fm diode, t p < 1 ms 400 a i fsm diode, t j = 150 c, 10ms; sin 1440 a i 2 t (diode) diode, t j = 150 c, 10ms 10 kas 2 driver v s1 stabilized power s upply 18 v v s2 non-stabilized power supply 30 v f smax switching frequency 20 khz dv/dt primary to secondary side 75 kv/s characteristics symbol conditions 1) min. typ. max. units igbt 11) v (br)ces driver without supply 3 v ces -- v i ces v ge = 0, t j = 25 c v ce = v ces t j = 125 c - - - 10 0,4 - ma ma v to t j = 125 c -- 1,38 v r t t j = 125 c -- 10,5 m w v cesat i c = 175a, t j = 125 c -- 3,2 v v cesat i c = 175a, t j = 25 c -- 3,05 v e on + e off v cc =600/900v,i c =200a t j = 125 c -- 60/98 mj c chc per skiip, ac side - 1,4 - nf l ce top, bottom - 15 - nh inverse diode 2) v f = v ec i f = 175a; t j = 125 c -- 2,45 v v f = v ec i f = 175a; t j = 25 c -- 2,55 v e on + e off i f = 200a; t j = 125 c -- 8mj v to t j = 125 c - 0,91 - v r t t j = 125 c - 5,7 - m w thermal characteristics r thjs 10) per igbt -- 0,129 c/w r thjs 10) per diode -- 0,375 c/w r thsa 6,10) p16 heatsink; see case -- 0,033 c/w driver i s1 supply current 15v-supply 340+360*f s /f smax +3,5*i ac /a ma i s2 supply current 24v-supply 250+240*f s /f smax +2,6*i ac /a ma t interlock-driver interlock-time 2,3 s skiippack protection i tripsc short circuit protection 250 2% a i triplg ground fault protection 58 +/- 2% a t trip over-temp. protection 115 5% c u dctrip 9) u dc -protection 920 2% v mechanical data m1 dc terminals, si units 4 - 6nm m2 ac terminals, si units 8 - 10 nm skiippack a a a a sk integrated intelligent power pack 3-phase bridge with brake chopper (e/a) skiip 232 gdl 120 - 410 ctv 7,9) preliminary data case s5gdl features short circuit protection, due to evaluation of current sensor signals isolated power supply low thermal impedance optimal thermal management with integrated heatsink pressure contact technology with increased power cycling capab ility, compact design low stray inductance high power, small losses over-temperature protection 1) t heatsink = 25 c, unless otherwise specified 2) cal = controlled axial lifetime technology (soft and fast) 3) without driver 4) driver input to dc link/ ac output to heatsink 5) with semikron-dc link (low inductance) 6) other heatsinks on request 7) c - integrated current sensors t - temperature protection v - 15 v or 24 v power supply 9) options available for driver: u - dc link voltage sense f C fiber optic connector 10) s referenced to temperature sensor 11) npt-technology with homo- genous current-distribution
? by semikron 28.01.99 skiip brake-chopper absolute maximum ratin g s symbol conditions 1) values units v isol 4) ac, 1min 3000 v t op ,t stg operating / stor. temperature -25...+85 c igbt and inverse diode v ces 1200 v v cc 5) operating dc link voltage 900 v i c igbt 200 a t j 3) igbt + diode -40...+150 c i f diode 200 a i fm diode, t p < 1 ms 400 a i fsm diode, t j = 150 c, 10ms; sin 1440 a i 2 t (diode) diode, t j = 150 c, 10ms 10 kas 2 driver v s1 stabilized power s upply 18 v v s2 non-stabilized power supply 30 v f smax switching frequency 5 khz dv/dt primary to secondary side 50 kv/s characteristics symbol conditions 1) min. typ. max. units igbt 11) v (br)ces driver without supply 3 v ces -- v i ces v ge = 0, t j = 25 c v ce = v ces t j = 125 c - - - 10 0,4 - ma ma v to t j = 125 c -- 1,38 v r t t j = 125 c -- 10,5 m w v cesat i c = 175a, t j = 125 c -- 3,2 v v cesat i c = 175a, t j = 25 c -- 3,05 v e on + e off v cc =600/900v,i c =200a t j = 125 c -- 60/98 mj c chc per skiip, ac side - 1,4 - nf l ce top, bottom - 15 - nh inverse diode 2) v f = v ec i f = 175a; t j = 125 c -- 2,45 v v f = v ec i f = 175a; t j = 25 c -- 2,55 v e on + e off i f = 200a; t j = 125 c -- 8mj v to t j = 125 c - 0,91 - v r t t j = 125 c - 5,7 - m w thermal characteristics r thjs 10) per igbt -- 0,129 c/w r thjs 10) per diode -- 0,375 c/w r thsa 6,10) p16 heatsink; see case -- 0,033 c/w driver i s1 supply current 15v-supply 67+10*f s /f smax +0*i ac /a ma i s2 supply current 24v-supply 67+10*f s /f smax +0,0*i ac /a ma t interlock-driver interlock-time 2,3 s skiippack protection i tripsc short circuit protection 250 2% a i triplg ground fault protection - a t trip over-temp. protection 115 5% c u dctrip 9) u dc -protection 920 2% v mechanical data m1 dc terminals, si units 4 - 6nm m2 ac terminals, si units 8 - 10 nm skiippack a a a a sk integrated intelligent power pack 3-phase bridge with brake chopper (e/a) skiip 232 gdl 120 - 410 ctv 7,9) preliminary data case s5gdl features short circuit protection, due to evaluation of current sensor signals isolated power supply low thermal impedance optimal thermal management with integrated heatsink pressure contact technology with increased power cycling capab ility, compact design low stray inductance high power, small losses over-temperature protection 1) t heatsink = 25 c, unless otherwise specified 2) cal = controlled axial lifetime technology (soft and fast) 3) without driver 4) driver input to dc link/ ac output to heatsink 5) with semikron-dc link (low inductance) 6) other heatsinks on request 7) c - integrated current sensors t - temperature protection v - 15 v or 24 v power supply 8) e - adapted to 400 vrms; u - adapted to 460 vrms 9) options available for driver: u - dc link voltage sense f C fiber optic connector 10) s referenced to temperature sensor 11) npt-technology with homo- genous current-distribution
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